Huawei plans to raise $2bn debt

Chinese telecom company Huawei Technologies Co. is planning to raise a $2bn through a USD-denominated bond maturing in 2026.

The company is still in discussions with banks on the terms of the issuance and the size of the deal.

Banks likely to manage the bond issue include DBS Bank, ANZ Banking Group, Standard Chartered and Bank of China.

According to bankers, it appears that the deal could be completed as early as  April 2016.

Previously, the company had issued a $1bn USD bond last year, which was oversubscribed.

Source: WSJ

 

 

 

 

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